Hi George
Right now we are stuck with microsections and will be until someone
has performance data for probably some sort of thermal cycling tests.
Eventually, I guess, if a sample passes so many thermal cycles (or
thermal shocks, perhaps) then we consider the product and process
to be good and we don't care how thick the copper hole walls are or
if there are voids or cracks present??????!!!!!!!!!

However, the thermal cycling tests take a long time and I would think
everyone will still use hole wall thickness and quality of plating to
predict that performance.  Microvias are not "stand alone" configurations
they are usually found on boards that have to see soldering temperatures
and therefore are subject to the question - how do they survive thermal
stresses.

Just my thoughts - but I see microsections to be with us for a little while
longer.

Susan Mansilla
Technical Director
Robisan Lab

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