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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 9 Dec 1999 11:21:46 -0500 |
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Thanks Blaine
well... I guess my question is answered
so, back to square one
Any ideas how this could be addressed as a move towards standardization ?
Wolfgang
> -----Original Message-----
> From: Test Engineering [SMTP:[log in to unmask]]
> Sent: Thursday, December 09, 1999 8:06 AM
> To: [log in to unmask]
> Subject: Re: [TN] electrical testing of bareboards
> Importance: High
>
> Wolfgang,
>
> I have the same concerns and issues as you. We have been faced with
> complaints of ICT failures due to TPvias not being probed whereas there is
> no definition or distinguishing factors that separate vias and endpoint
> vias. To add to this, several of our long term customers have supplied
> aperture sizes specific to TPvias but have added a new design house that
> did not define these vias. To many variables are leaving the test world to
> second guess design and testability.
>
> Taking notice to the responses before mine, I seen the words "most have",
> "could be", "usually are", in those statements. To those gentlemen, please
> don't take offense, I point these out as the variables I mentioned.
>
> For us to do our job correctly and accurately, a standard definition would
> be perfect. I had stated this to designers during the IPC BBT expo in May
> 99 with little positive response. This is one of many issues where it has
> become imperative for the test and design worlds to converge and together
> deliver the product our customers expect and deserve.
>
> Blaine R. Shelkey
> Test Engineering Manager
> TYCO PCG/Melbourne
> 600D John Rodes Blvd.
> Melbourne, Fl. 32934
>
> 321.308.8843 (Ph)
> 321.308.8868 (Fax)
> Email: [log in to unmask]
> <http://www.iu.net/aqc>
>
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