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December 1999

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From:
"Maguire, James F" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Dec 1999 01:34:08 -0800
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We haven't done enough microvia sections that we couldn't do 1 section/mold.  One thing I didn't add earlier was we did initially have problem in that the microvia PWAs were also thin and tended to easily "deform" around the steel pin (during driving of pin into coupon and subsequent handling prior to mounting.)  We addressed this by bonding (with the 1 minute cure "super glue" cyanoacrylate) a piece of 0.062 material to the top of the coupon prior to aligment (NOT over via but only over area where the reference pin holes were to be drilled).  This helped a lot.

> ----------
> From:         edward edward szpruch[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;edward edward szpruch
> Sent:         Wednesday, December 08, 1999 9:52 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] microsectioning equipment for microvias
> 
> Suzan , Jim , Edward and Rick
> Thank you for reply.
> We are using the standard Buhler equipment and accuracy  problems , as you
> probably know , are tremendous: normally we are missing the center and the
> angle , so even when we are not missing the whole via , the picture of via
> is disturbed.I have to measure diameters to assure,that the via is cut in
> the center before thickness measurements are taken.
> If the microsection is taken from the panel itself , our rate of success is
> 1 of 4 .
> I understand , that there is no "magic equipment " or shortcut, just
> routine, slow and exact work
> Providing usage of positioning pins , how many pieces per mould are
> recommended and how many moulds per head ?
> Edward
> 
> Edward Szpruch
> Eltek , Manager of Process Engineering
> P.O.Box 159 ; 49101 Petah Tikva Israel
> Tel  ++972 3 9395050 , Fax  ++972 3 9309581
> e-mail   [log in to unmask]
> 
> > -----Original Message-----
> > From: Maguire, James F [SMTP:[log in to unmask]]
> > Sent: > ד דצמבר 08 1999 23:34
> > To:   [log in to unmask]
> > Subject:      Re: [TN] microsectioning equipment for microvias
> > 
> > We've used the tooling from Buehler Nelson-Zimmer system with success,
> > bigest issue is vias (typically 75micrometer and smaller) where the actual
> > location of the via in the pad can't be readily determined visually (which
> > is necessary to align tooling).  Were we can locate them the system works
> > well.  If we can't see the vias (or more properly a "dent" in the pad) we
> > section at a slight angle to the via to via centerline and figure,
> > covering a range of potential via positions and usually get 2-4 "good"
> > cuts.
> > 
> > We have also (in "one up" cases where setting up the tooling isn't
> > justified) done the "grind till ya find it" technique which is tedious.
> > 
> > Jim
> > 
> > > ----------
> > > From:         [log in to unmask][SMTP:[log in to unmask]]
> > > Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> > > Sent:         Wednesday, December 08, 1999 12:31 PM
> > > To:   [log in to unmask]
> > > Subject:      Re: [TN] microsectioning equipment for microvias
> > >
> > > We also use traditional methods - tedious - but can be done
> > > Would not process 30 sections in one mount and 9 mounts in a head
> > > like routine through hole production.
> > >
> > > Susan Mansilla
> > > Technical Director
> > > Robisan Lab
> > >
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