Does anyone have a $ value regarding Ni/Pd/Au v.s. electrolytic Ni/Au?
Many thanks.
                          joyce
At 07:07 AM 12/8/99 -0700, you wrote:
>Paul,
>        I suspect the use of Palladium is to prevent "black pad" since it has
>been found to occur during the immersion gold process.  With a Palladium
>layer on the nickel, hyper corrosion of the nickel should not occur (in
>theory).  (it still sounds expensive).
>
>
>                        Thanks
>
>Ryan Grant
>Process Development Engineer
>MCMS
>(208) 898-1145
>FAX (208) 898-2789
>[log in to unmask]
>
>
>
>
>
>
>No problems 1-5 Darrel, just ask him why standard (flash) NiAu would not
>be
>sufficient .
>>From distance i can't see the need for Pd instep expense.
>Check net's archives , all there
>
>pk
>
>-----Original Message-----
>From: Darrel Therriault [mailto:[log in to unmask]]
>Sent: Tuesday, 7 December 1999 4:59
>To: [log in to unmask]
>Subject: [TN] Ni/Pd/Au
>
>
>TechNet,
>
>A PWB supplier is recommending a Ni/Pd/Au finish for .062" and .093"
>FR-4
>PWB
>with mixed PTH/SMT components, as well as press fit connectors.
>
>Any comments/guidance, pro or con,  regarding :
>
>1.   Intermetalics
>2.   Rework cycles
>3.   Gold embriddlement
>4.   Fine pitch or BGA components
>5.   Pressfit
>
>All info appreciated.
>
>Regards.......DT
>
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