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December 1999

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Subject:
From:
Nancy Trumbull <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 7 Dec 1999 13:07:11 -0500
Content-Type:
text/plain
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text/plain (47 lines)
Hi Steve,
Just want you and others to know QA are people too.
In fact I'm one. 
Remember this is new to them too.  Just reconfirm their understanding of the 610 standard . Just because it looks different does not make it bad.  I have the same problem with new and old QA associates sometimes they have  a bad habit of judging by .

( But I don't like it )  ( Or the other way looked different )

This to me is  insufficient knowledge when these statements are made.  I believe people make these statement when they do not understand or have information to help them in their decision.
So maybe they need to take another look at your parts or they need a better understanding of the standards.

Oh yes make use customer will approve a 25 % void or your dead in your water

Your 25 % void needs to be taken at the lowest point.
But to get to your problem.
Yes we also use a spray flux.
Sometime we have under fills or as we say 25% void on the primary side.
As you said 25 % is an acceptable conditions on PTH with Components.  and I hear they are looking into a 50% approval condition.
But it also should make you ask why. 
What all changed or should change 
Have you  done a process profile for this product  under the new condition. 
Question 
Is you heating time to short
Are the voids on the same type of component
Is the solder pot to low 
Is the sprayer located in an adequate area
Is there sufficient flux being spray
Is the pressure high enough to attain a good solder condition

We find that under the correct condition we get 90% or better fill.

Good Luck
Nancy

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