Hi,
I hope I can answer your question properly.
We are using Entek106+.I think you had this one in mind.
We are still working in dip ( vertical) mode and not in horizontal
equipment.
Thickness problems are mainly related to the age of the solution : as
solution becomes older,with the same process parameters such as
concentration,temperature,dwell time,drip time , the coating is thicker.
Another point is the way you are measuring the thickness and around this
they are a lot of missunderstundings:
1) if measurement is done on specimen using spectriphotometric method,you
should have in mind , that the copper of specimen should have the
microstructure as the actual board,otherwise the result will represent the
particular speciment and nothing more.
2) we are using SERA equipment and the measurement is done on actual
board.We found this methot much realistic , than usage of specimens.
 regards
Edward Szpruch
Eltek , Manager of Process Engineering
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9395050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]

> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: ג דצמבר 07 1999 12:33
> To:   TechNet E-Mail Forum.; edward edward szpruch
> Subject:      Re: [TN] Difference between OSP & Entek '106A'
> 
> 
> 
> Hi  Edward
> 
> Did  your  company  using  the  106A  type  or  the  improvised  106A  (
> X
> )  type  .  We  had  change  to  the  one  with  the  PC  106  one
> recently  and it  seem  that   the  entek  thickness   is  more  difficult
> to control  than  the  older  version  .
> 
> According  to  Ethone  ,  the  main  advantages  of  this newer version is
> to  prevent  "  gold  tarnish  "  on  top of  gold surface   . Would  like
> to heard  your  side  experience
> 
> W L lee
> WUS  Printed circuit Singapore
> 
> 
> 
> 
> edward edward szpruch <[log in to unmask]> on 12/07/99 06:03:16 PM
> 
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> respond
>       to edward edward szpruch <[log in to unmask]>
> 
> To:   [log in to unmask]
> cc:    (bcc: Wei Leong Lee/WUSSG)
> Subject:  Re: [TN] Difference between OSP & Entek '106A'
> 
> 
> 
> 
> Entek 106+ is one of the OSP`s on the market.
> regards
> Edward Szpruch
> Eltek , Manager of Process Engineering
> P.O.Box 159 ; 49101 Petah Tikva Israel
> Tel  ++972 3 9395050 , Fax  ++972 3 9309581
> e-mail   [log in to unmask]
> 
> > -----Original Message-----
> > From: Ko Adeline-FSGA2298 [SMTP:[log in to unmask]]
> > Sent:  << File: ATT05345.txt >> 

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