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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 16 Dec 1999 17:02:00 +0000 |
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Jason,
I've been through a similar situation before. If you have to keep the OSP
finish, try reflowing your boards in a Nitrogen atmosphere this will help
the degradation of the OSP. Then keep the time between reflow and wave
solder to a minimum.
Martin
===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
12/16/99 12:49 pm
>I am having problems with wave soldering OSP boards. After the boards have seen
>a heat cycle (reflow), they are impossible to get hole fill on topside without
>first cleaning the boards to remove either oxidation or hardened OSP. I don't
>know which one I have because I haven't had them analyzed yet. The flux used to
>wave solder the boards is a very weak customer dictated rosin no clean flux.
>The OSP is Cu106A. I am not familiar with OSPs. They won't do HASL either.
>Any insight? Suggestions? Assistance?
>
>As it stands now, the process is to flux with high solids water soluble/heat to
>clean the board-->wash off flux-->immediately wave solder with rosin containing
>no clean. This is not a production process........
>
>Jason Smith
>Process Materials Engineer
>Lexmark Electronics
>
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