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December 1999

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Sender:
TechNet <[log in to unmask]>
X-To:
Brunker Ed <[log in to unmask]>
Date:
Wed, 1 Dec 1999 12:53:06 +0100
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Ingemar Hernefjord (EMW)" <[log in to unmask]>
Subject:
Re: GLASS SUBSTRATE
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From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
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Strange that you ask, Edward,
we are trying this method ourselves by means of 0.12 micron thick special glass plates. They have to ber diced and GelPak“d also in our case. If you give me one day or two, I will get the adresses.
alea acta est (the die is placed) old roman process engineering expression.
Ingemar Hernefjord



Anyone know of a source for a graduated glass substrate which is suitable
for a Capability study on pick and place equipment. Particularly one
suitable for passive components.
Regards
Edward Brunker

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