TECHNET Archives

December 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Dec 1999 21:09:34 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
mike


just out of curiosity - try taking section and see if the nodules rise from
the surface of the copper topography - u'll have to make a makeshift sorta
3-d thing - slant it somehow when looking. if it does - try doing a trace
metal analysis with an AA for tin in solution. if your above 20ppm - u might
be co-depositing tin with in your copper. if that;s the cas - try dummying at
about 3-5 asf for about 8 hrs and do another tin analysis.

regards

Richard Fudalewski

Florida CirTech

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2