Curious as well Edwin,
With NiAu board and 3.9Ag in alloy (and component metalisation) I wonder how
the IMT's will stand in cycling.
From what I've seen before it would be too strong not to be brittle,
with large (1206) ceramics on FR-4 CTE ?
Hope you'd tell me (quantifiably)'m mistaken .
Something is validated somewhere, the (why?)step from 3.9 reflow to 3.5 wave
is intriguing

thanks ahead

Paul Klasek
ResMed

-----Original Message-----
From: Kirk D Mueller [mailto:[log in to unmask]]
Sent: Saturday, 4 December 1999 10:27
To: [log in to unmask]
Subject: Re: [LF] IPC News Release: Assembly Industry Asks Suppliers to
Ch oose Alloy


     Can I have a copy of the report describing the reasons why those alloys
were chosen?

Thanks,
Kirk Mueller
Raytheon Systems Co.






Bradley Edwin-EEB002 <[log in to unmask]> on 12/03/99
02:24:57
PM

Please respond to "Leadfree Electronics Assembly E-Mail Forum."
      <[log in to unmask]>; Please respond to Bradley Edwin-EEB002
      <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Kirk D Mueller/RWS/Raytheon/US)
Subject:  Re: [LF] IPC News Release: Assembly Industry Asks Suppliers to Ch
      oose              Alloy




In my mind the choices have been made.  The NEMI Pb-free Project has chosen
to move forward with Sn-3.9Ag-0.6Cu for our evaluations of reflow
appliations and Sn-0.7Cu
and Sn-3.5Ag for wave applications.  European activities have also
identified
the Sn-Ag-Cu family as the recommended Pb-free alloy family.  Thus the
component finishes must work with those similar alloys.  There is no need to
wait until April 2000, the OEMs and EMSs have already made the choice and
the solder suppliers can supply these alloys.

Regards,
Edwin Bradley
Chair of the NEMI Pb free project

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