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Reply To: | Leadfree Electronics Assembly E-Mail Forum. |
Date: | Fri, 17 Dec 1999 10:27:40 +0800 |
Content-Type: | text/plain |
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Kenghwa,
You may get some answers (1 and 2) of your questions by searching this
patent.
Regards,
Han Jiangbo
ICBD-SGP, Agilent Technologies
-----Original Message-----
From: Teo Keng Hwa [mailto:[log in to unmask]]
Sent: Thursday, December 16, 1999 9:28 PM
To: [log in to unmask]
Subject: [LF] IOWA State University's Patent on Sn/Ag/Cu solder
Hi,
I am Kenghwa Teo of Institute of Microelectronics (IME), Singapore. I am a
new subscriber to the forum.
I just understood that in the recent SEMICON-Japan, there was lively
discussion on the patent of IOWA State University on Sn/Ag/Cu alloy. May I
have the insight from anyone of you on the following:
1. What is the exact alloy composition that the patent covers?
2. How much IP rights does the patent claim? Does it extend to majority of
Sn/Ag/Cu alloy?
3. Understand that IOWA has licensed its patent to 3 companies i.e. one each
in USA, UK and Japan. Is it true and who are they?
Looking forward to hearing from you.
Thanks & regards,
Kenghwa Teo
DID: 65-7705 417
Fax: 65-7745 747
mailto:[log in to unmask]
http:\\www.ime.org.sg
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IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
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For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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