Not to be too blunt, but this press release is just plain wrong. The
alternative alloy roadmap session proposed SnAgCu as the alternative alloy.
SnAgBi was discussed as a secondary alloy for specific SMT applications
only, and only pending a series of lead-contamination tests. This is
verified in the session leader's notes (PP Presentation).
As I have seen this error in a variety of publications, I think that this
merits immediate resolution.
-----Original Message-----
From: Christopher Jorgensen <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, December 03, 1999 10:22 AM
Subject: [LF] Fwd: IPC News Release: Assembly Industry Asks Suppliers to
ChooseAlloy