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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 16 Dec 1999 07:49:46 -0500 |
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I am having problems with wave soldering OSP boards. After the boards have seen
a heat cycle (reflow), they are impossible to get hole fill on topside without
first cleaning the boards to remove either oxidation or hardened OSP. I don't
know which one I have because I haven't had them analyzed yet. The flux used to
wave solder the boards is a very weak customer dictated rosin no clean flux.
The OSP is Cu106A. I am not familiar with OSPs. They won't do HASL either.
Any insight? Suggestions? Assistance?
As it stands now, the process is to flux with high solids water soluble/heat to
clean the board-->wash off flux-->immediately wave solder with rosin containing
no clean. This is not a production process........
Jason Smith
Process Materials Engineer
Lexmark Electronics
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