Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 15 Dec 1999 11:54:59 -0500 |
Content-Type: | text/plain |
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Geeze,
I have run into this time and time again. Up front costs versus rework, in
field service, and acquiring a reputation for shoddy product. Man, I can
tell you from experience you better fill that PTH all the way. Also if it
is a large cap, you may want to anchor it to an even larger part via some
sort of RTV or other adhesive method. Vibration can be a pain. When we had
an issue with this, we ended up placing a piece of thin board laminate down
on the board, puttting the part in, clinching it, wave soldering it,
removing the laminate that was used as a temporary spacer and then using RTV
to attach it to a large transformer.
Mark Ross
-----Original Message-----
From: Jean-Francois Bissonnette [mailto:[log in to unmask]]
Sent: Wednesday, December 15, 1999 11:39 AM
To: [log in to unmask]
Subject: [TN] Ceramic capacitors
Hello technetters!
Well thank You for your enthousiastic answers concerning
your identities. I'll give you some details about my
occupations ounce I get rid of some fires here (it's funny,
nobody mentioned firefighter!!!).
Some people here are getting pretty nervous about one
IPC-A-610 criteria here and honestly I dont know what
what to tell them to ease their worries.
Par. 3.2.4 says that class 1 & 2 permits coating meniscus
of capacitor to be mounted into PTH. But is'nt there a
risk of preventing the solder to be conform to criteria
4.1 table 1 (saying that the solder must fill 75% of
the hole)? What is the risk of not respecting this criteria
(3.2.4). Personnaly I would fear craquing for the capacitor
on the long run (plus the solder fill), this thing will be submit
to constant vibrations (It goes on a train, near the braking system).
So I would prefer to have it above the meniscus. But here they
are concerned with the overall costing... Well I guess I need
some of these 5000 years of experience now!
Thank You! See you around!
JF
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