Hi,
I ve been cross sectioning as a way to evaluate micrivias in terms
of quality of registration
plating uniformity
via registration to the capture pad and via pad
quality of adhesion of the copper to the underlying dielectric
and any other defects possible

and i dont thinlk of any other way i could get the above, other than by
doing cross sectioning...and the vias here are in the 2-8 mil range...

so am i missing out on something.some other novel method??


At 09:19 AM 12/09/1999 -0500, you wrote:
>Susan M, and Technet at large,
>
>Iis there any evidence that microsectioning is a valid method of
determining the
>quality of micro vias?  (Except for the "this is what we have always done"
argument.)
>A statement was made at the recent HDI conference in Austin TX that it was
not.
>
>Of course that did not prevent anyone from pulling out their pictures of
Cross Sections
>during the 'show and tell' time.
>
>George Franck
>Raytheon Company
>
>[log in to unmask] wrote:
>
>> Pins are nice and work really well for larger holes BUT with the microvias
>> they probably won't serve the same purpose or success.
>>
>> The reason for this is that the center lines of the vias are rarely the
same -
>> to me that is one of the main problems -
>>
>> In a row of microvias you may be able to look at one at a time due to the
>> slight misregistration of position.
>>
>> We use pins (2) - we drill their location with an Excellon Unidrill -
but do
>> not
>> rely on all vias coming into view at the same time.
>>
>> Susan Mansilla
>>
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