Avoiding additional thermal cycles is a good thing, but I don't know any
UV's that can withstand the chemical attack of ENi/ImAu, White Sn or the
thermal extremes of Level.
UV over bare copper for HASL can be done; but it's probably not worth the
"hassle".
If you find the rot cause for touch-ups please let me know.

Tip: keep your steps high and UV bump and or use UV marking to avoid mask
issues at ENi/ImAu and White Sn.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Scott Kivi
Sent: Monday, November 29, 1999 12:32 PM
To: [log in to unmask]
Subject: [TN] Soldermask Touchup


Welcome back after the Thanksgiving break. If anyone has any input on this
subject it would be greatly appreciated.

We are evaluating the option of using a UV curable soldermask for soldermask
touchups to cover minor scratches and such. Currently we are using the same
soldermask material for touchup as we are for the coating. In essence of
time, and to avoid an additional thermal cycle we are searching for other
options. Is there any drawbacks to using a UV curable mask for this purpose?
In the past UV materials have been known to have poor adhesion qualities. I
am curious, has this changed with any newer materials?

The soldermask touchup could see processes like Immersion gold, White tin or
Hot air leveling where adhesion would be critical.

Please let me know and have a great day!

Scott Kivi
Circuits DMA

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