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December 1999

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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 21 Dec 1999 05:00:00 EST
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Craig Hillman <[log in to unmask]>
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Subject:
HCl clean of Ni/Au plating
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1.0
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Organization:
CALCE EPRC
From:
Craig Hillman <[log in to unmask]>
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Hello Technetters,

        Is HCl clean of the nickel pads sometimes a step in the Ni/Au
plating process? If it is, why is it done?

Thanks for your response,
Happy Holidays,
Craig

Dr. Craig Hillman
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD  20742
(301)-405-5316
[log in to unmask]

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