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December 1999

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Date:
Tue, 21 Dec 1999 05:00:00 EST
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"TechNet E-Mail Forum." <[log in to unmask]>, Craig Hillman <[log in to unmask]>
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CALCE EPRC
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Craig Hillman <[log in to unmask]>
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Hello Technetters,

        Is HCl clean of the nickel pads sometimes a step in the Ni/Au
plating process? If it is, why is it done?

Thanks for your response,
Happy Holidays,
Craig

Dr. Craig Hillman
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD  20742
(301)-405-5316
[log in to unmask]

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