Hello K.K.,
Motorola's Semiconductor technical data, AN1231 for Plastic Ball Grid
Array,
Table 2, provides a mold compound thermoconductivity value of 0.67 W/m
(superscript: .)(superscript: o)K.
Best Regards,
Shean
To: [log in to unmask]
cc: (bcc: Shean Dalton/ElectrovertUS/Cookson)
Subject: Re: [TN] IC package plastic molding compound
In a message dated 11/01/1999 1:04:36 PM Central Standard Time,
[log in to unmask] writes:
Hi K.K.,
In Phil Marcoux's book; Fine Pitch Surface Mount Technology, where he
discusses solder reflow, he has a diagram that shows the thermal
conductivities for typical materials used in printed circuit assembly
(copper, fr4, ceramics, etc.) and he lists plastic as 0.2w/m K ?.
-Steve Gregory-
<< K.K.-
Didn't see any replies, so I'll quote a number that was handy-
16 x 10^-4 cal/cm-sec deg C
taken fom page 81, Table 8.1, "Typical Characteristics of Molding Compound
Properties", from the Text "Plastic Encapsulated Microelectronics", Ed. by
M. Pecht, L. Nguyen, and E. Hakim, TK7874.P428 1995, ISBN 0-471-30625-8,
John Wiley & Sons.
Michael Alderete
------------------------------
Date: Fri, 29 Oct 1999 15:39:23 -0700
From: KK Chin <[log in to unmask]>
Subject: IC package plastic molding compound
Can anyone tell me what's the bulk thermal conductivity of the plastic
molding
compound in an IC package, in the unit of W/M-K?
Thanks!
K.K. Chin
Artesyn Technologies
Fremont, CA. >>
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