I was wondering if someone could offer some suggestion to a problem that we
are encountering. We use LPISM and apply it by screen printing. We screen
one side , tack dry and than screen the second side. We tack dry that and
then image and develop. We are getting S/M in the holes and are unable to
remove it through the developer. It is difficult to do one side at a time
since we use pumice scrubbing to clean the panels. Can some recommend nozzle
configuration and pressure of nozzles. Any other comments would be welcomed.

Regards

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