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November 1999

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Subject:
From:
Hinners Hans Civ WRALC/LYPME <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Nov 1999 16:42:04 -0500
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        Hi Rudy!

> Vee haf vays off dealing with dies problem, jah?
>
        Jah.  Especially if you watched 'Laugh In' apparently.  What are de
ways O Jedi Master?

> You are baking the boards after applying a corrosive mixture like flux to
> the
> surface?  Jah?
>
        The flux is RMA so it isn't toooo corrosive but yes.

> If you were NOT getting corrosion, I would be surprised.
>
        We don't get corrosion all the time just often enough that I want to
nail the sucker down and drive on.

> It is my guess, that if the corrosion is not on the board before this
> step,
>
        Once the tin plated pins are pressed in there are little shavings
over the board area . . . I plan to turn in my engineer's pocket protector
and

> it would be afterwards, especially if the baking were being done
> "casually",
> and not under strict minimum time and temperature guidelines.
>
        We can always tighten up the procedures especially when they don't
'seem' critical to those doing the work.

> Check to see if you have corrosion before soldering, perhaps by running a
> bare panel down the solder line, with no flux and/or baking?
>
        Will do.  I feel the urge to do several experiments coming on.  To
check the solder mask, the baking, the wave.

> Good luck = Hard Work
>
        Hans

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