TECHNET Archives

November 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Hinners Hans Civ WRALC/LYPME <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Nov 1999 21:40:47 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
Hi Ramsey,

        Did you eliminate the problem?  What's the fix?

        We have wanted to switch to a water soluble mask.  This might be the
perfect 'motivation' for me to do a validation test.

        Hans

> We experienced intermittent corrosion after wave solder at land patterns
> that had been protected by temporary latex solder mask. We discovered
> that the natural latex, low ammonia, types were less conducive, but
> would still produce corrosion.
> The variable in the process seems to be thickness. The mask should be
> applied in as thin a layer as possible. Thick mask must trap ammonia
> under the mask. Baking a thick layer of the mask seems to make the
> problem worse. Since the mask skins over the board  and protected land
> pattern are baked in ammonia corrosion results.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2