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November 1999

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Subject:
From:
Michael Becker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Nov 1999 15:30:31 -0500
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I am planning on bonding Polyimide PWB's to centerline heatsinks using an
Epoxy B-stage material.  Does anyone have experience with the process used
to do this.  I am interested in Temperature, pressure, time information.  I
am planing on using an AlliedSignal product called A11.
The purpose of this bondline is to constrain the PWB during temperature
cycling.  I am looking to get a CTE of less than 10 over the temperature of
-55 to 125 C

Any information would be helpful
Thanks,

Michael Becker
Mechanical Engineer
Raytheon Systems Company
Baltimore, Maryland
410-583-4036
[log in to unmask]
Instant Messanger:  mbecker999

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