In a message dated 11/01/1999 1:04:36 PM Central Standard Time, 
[log in to unmask] writes:

Hi K.K.,

In Phil Marcoux's book; Fine Pitch Surface Mount Technology, where he 
discusses solder reflow, he has a diagram that shows the thermal 
conductivities for typical materials used in printed circuit assembly 
(copper, fr4, ceramics, etc.) and he lists plastic as 0.2w/m K º.

-Steve Gregory-

<< K.K.-
 
 Didn't see any replies, so I'll quote a number that was handy-
 
 16 x 10^-4 cal/cm-sec deg C
 
 taken fom page 81, Table 8.1, "Typical Characteristics of Molding Compound
 Properties", from the Text "Plastic Encapsulated Microelectronics", Ed. by
 M. Pecht, L. Nguyen, and E. Hakim, TK7874.P428 1995, ISBN 0-471-30625-8,
 John Wiley & Sons.
 
 Michael Alderete
 ------------------------------
 
 Date:    Fri, 29 Oct 1999 15:39:23 -0700
 From:    KK Chin <[log in to unmask]>
 Subject: IC package plastic molding compound
 
 Can anyone tell me what's the bulk thermal conductivity of the plastic
 molding
 compound in an IC package, in the unit of W/M-K?
 
 Thanks!
 
 K.K. Chin
 Artesyn Technologies
 Fremont, CA. >>

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