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November 1999

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Nov 1999 07:12:42 -0600
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Hi Mike! I have had very good success with the application of SERA on
characterizing the solderability of both tin and tin/lead surface finishes.
However, just because you have a "quick" test it doesn't mean you have an
understanding of the solderability of a surface. The ANSIJ-STD-003 has several
test methods that may be useful in addition to SERA testing. What are your
expectations of the solderability test results and how do you want to use that
data?

Dave Hillman
Rockwell Collins
[log in to unmask]




Mike Bailey <[log in to unmask]> on 11/03/99 07:26:39 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Mike Bailey <[log in to unmask]>

To:   [log in to unmask]
cc:

Subject:  [TN] Solderability Procedure for White Tin



Is anyone familiar with a reasonably quick test to determine solderability
of white tin surfaces?   As a fabricator of QTA product, we have little time
for verification, but like most of you, the end product liability is
tremendous.  Tests that verify first time solderability are not relevant.
Thru-hole coupons are likewise not preferred as extremely little product is
of that technology.   The issues are multiple thermal cycles using various
methods of heating.
I've heard SERA tossed around, but would that be practical for testing other
than virgin product?
Thanks for any replies

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