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November 1999

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Subject:
From:
"Alderete, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 1 Nov 1999 10:54:32 -0800
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K.K.-

Didn't see any replies, so I'll quote a number that was handy-

16 x 10^-4 cal/cm-sec deg C

taken fom page 81, Table 8.1, "Typical Characteristics of Molding Compound
Properties", from the Text "Plastic Encapsulated Microelectronics", Ed. by
M. Pecht, L. Nguyen, and E. Hakim, TK7874.P428 1995, ISBN 0-471-30625-8,
John Wiley & Sons.

Michael Alderete
------------------------------

Date:    Fri, 29 Oct 1999 15:39:23 -0700
From:    KK Chin <[log in to unmask]>
Subject: IC package plastic molding compound

Can anyone tell me what's the bulk thermal conductivity of the plastic
molding
compound in an IC package, in the unit of W/M-K?

Thanks!

K.K. Chin
Artesyn Technologies
Fremont, CA.

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