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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 30 Nov 1999 14:25:27 -0700 |
Content-Type: | text/plain |
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I'm trying to find out any information concerning the maximum board warpage
that BGA packages can handle. Are there any industry standards specifying a
localized flatness at BGA device sites? Any information would be
appreciated.
Thanks,
Brian C. Hunter
One StorageTek Drive, MS 9152
Louisville, CO 80028
303.661.5756 phone
303.673.3466 fax
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