I only have experience with Electroverts Lambda, Omega, and Chip nozzles so
I cannot comment on Soltecs nozzle function.  But I do agree that on a
Lambda wave, when the surface solder separation speed and the conveyor
speed are equal and in the same direction,that the least amount of bridging
occurs, relative to changing the solder flow and or conveyor speed.

But even then, bridging will still occur to some small degree.  That is
where the smoother wave comes into play.   The separation of the solder
from the lead needs to be free of interference.

Adjustment of Lambda nozzle turbulence are fairly simple in that there is
front flow adjustment, direct upwards flow (pump speed),  wave depth (rear
wing gate height adjustment) and then rear flow (wing adjustment).  The
turbulence resulting from the front flow is actually a good thing as this
basically is a washing action.  The configuration of the wave at interface
between the upwards flow and rear flow is approximately where the board
exits the bath and this area must be turbulence free.

A simple analogy is appropriate here.

Put a stick in stream of water and look at the turbulence created just past
the stick.  Get rid of the stick and the turbulence goes away.

Hope this helps..


Phil

At 09:47 AM 11/30/99 -0600, Gary Camac wrote:
>John,
>
>I have always heard that you achieve less bridging when the speed and
direction of the
>wave match the speed and direction of the assembly.
>
>Gary Camac
>
>John Harris wrote:
>
>> Do you consider a very slow moving wave at the break point the key to
>> eliminating connector bridging? I'm fairly new to the game, and we run
>> Soltec's here which typically have turbulent waves. I am very interested in
>> any theories as to how the ideal wave should act to prevent this problem
>>
>> Thanks
>>
>> John Harris
>> Process Engineer
>> AEMS Pty Ltd
>>
>
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