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November 1999

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Subject:
Re: BLIND VIA FAB:
From:
Brunker Ed <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 30 Nov 1999 08:43:10 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (84 lines) 
Yes, thanks for the response. Yes, I'm referring to the entire surface
particularly with regard to fine tracking on outer layers.
Regards
Edward Brunker

-----Original Message-----
From: Ed Cosper [mailto:[log in to unmask]]
Sent: Monday, November 29, 1999 2:39 PM
To: [log in to unmask]
Subject: Re: [TN] BLIND VIA FAB:


Are you referring to double plating the entire external surface???

Ed Cosper
ABC

----- Original Message -----
From: Brunker Ed <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, November 25, 1999 3:52 AM
Subject: [TN] BLIND VIA FAB:


> When fabricating PCBs with blind vias, are there any alternatives to
double
> plating the outer layers? What design for manufacturability issues are
there
> regarding this technology?
> Regards
> Edward Brunker
> Principal Process Engineer
> Sendo
> Centrelink House
> Small Heath Business Park
> B10 0HJ
> UK
>
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