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November 1999

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Subject:
From:
Scott Rebman <[log in to unmask]>
Reply To:
Date:
Mon, 29 Nov 1999 12:52:41 -0800
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Phil,

At this point I have received only one quote on gold plating this board,
others are due this week.  In correspondence with this particular vendor he
has stated that he builds boards for other customers using this method and
thickness of plating.  He suggested I specify the plating "Full panel
electrolytic gold plating min. 5u" Au over 100u" Ni".

I am curious to see what other vendors quote.  I had hoped to hear through
TechNet how some other places specify their gold plating.

Regards,
Scott


-----Original Message-----
From:   Phil Crepeau [SMTP:[log in to unmask]]
Sent:   Tuesday, November 23, 1999 9:18 AM
To:     [log in to unmask]
Subject:        Re: [TN] Gold plating specifications

hi,

sorry i can't answer your question, but i do have a comment.  do you think
that this thickness (thinness) of gold will provide the protection you are
looking for?

phil

-----Original Message-----
From: Scott Rebman [mailto:[log in to unmask]]
Sent: Tuesday, November 23, 1999 8:33 AM
To: [log in to unmask]
Subject: [TN] Gold plating specifications


Good day all,

I am going to specify gold plating on a PCB and am curious as to how the
rest of the world specifies such things.

The board is FR-4, double sided with 2 oz copper.  The quote I currently
have  is for electrolytic plating 0.05~0.20um thick.  The board is
populated with both through hole and SMT components.

The purpose of going with the gold plating is to keep the pads under an
elastomeric connector from oxidizing.  Oxidation on these pads has caused
problems with segments of an LCD becoming dim or blank.

Thanks in advance for the assistance.  With the exception of a few flaming
jerks, this is a great board.

Scott

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