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November 1999

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Subject:
Banking agent for copper etching
From:
Pai Daniel MSM LAPO US <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Nov 1999 20:14:00 +0100
Content-Type:
text/plain
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text/plain (22 lines) 
Dear TechNet Guru:
I heard a lot about using "banking agent"  in copper etchant solution to
reduce sideway etching.  Does anyone know what type of chemicals were used
and what is the theory behind it?


Daniel

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