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November 1999

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Subject:
From:
Scott Kivi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Nov 1999 12:32:03 EST
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Welcome back after the Thanksgiving break. If anyone has any input on this
subject it would be greatly appreciated.

We are evaluating the option of using a UV curable soldermask for soldermask
touchups to cover minor scratches and such. Currently we are using the same
soldermask material for touchup as we are for the coating. In essence of
time, and to avoid an additional thermal cycle we are searching for other
options. Is there any drawbacks to using a UV curable mask for this purpose?
In the past UV materials have been known to have poor adhesion qualities. I
am curious, has this changed with any newer materials?

The soldermask touchup could see processes like Immersion gold, White tin or
Hot air leveling where adhesion would be critical.

Please let me know and have a great day!

Scott Kivi
Circuits DMA

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