Dear Mr. Savard,

I am sorry to say that I do not agree with your short summary on the
mechanism of pulse periodic reverse technology for copper plating on PCB and
especially what you call the 'stripping' phase.
I do not believe that you want to strip the copper. This would induce
unsatisfactory roughness of the deposit and probably unappropriate
metallurgical properties (for the PCB specs).

The very short and very intense reverse pulse is actually designed to modify
the polarization characteristics on the boards (basically increasing
polarization at high current density area). Of course, the chemistry will
then play a very important role also because she needs to be able to
'respond' to the pulse and this, at a quite high frequency

Without going into details, this proposed theory has been demonstrated and is
based on electrochemical studies which clearly showed the influence of such
pulses on polarization.

One last thing, if it would be based on pure 'stripping' of the copper, we
could assume that it would work with any chemistry. Believe me, it is not ....

Sincerely,
Stephane Menard
Micropulse Plating Concepts

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