Can anyone answer / help with the following questions

1. What is the IPC moisture sensitivity level for these components (time out
of bag rules)?
2. What is the recommended bake / dry out procedure for (i) components in
JEDEC matrix trays (ii) components in tape and reel (if baked in tape and
reel format, is there any likelihood of tape shrinkage or outgassing
affecting solderability)?
3. Has anyone conducted any weight loss / weight gain experiments for these
type of packages? If so, has anyone got a copy of the graphs / reports?
4. Has anyone tried using dry (dessicator) boxes (using either Nitrogen or
dry air as a medium) as a method of storing (or drying out) prior to
placement / reflow of these components? If so, what were the results?
5. What part of the package is most sensitive to moisture ingress? Is it the
FR4 or the epoxy encapsulant?


Thank you.

Martin Christie
Process Engineer,
ACW Technology
Tel: +44 (0)1730 300000 x146


Regards,

Martin Christie
01730 300000 x146

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