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November 1999

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Subject:
From:
Carey Pico <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Nov 1999 11:39:05 -0800
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Scott
Are these elastomers those soft connector pads developed at MCC?  I suggest
you contact them for advise.  I also believe Planar America (the flat panel
display people) tried to implement those, although at the time they passed
on the technology.  What is wrong with ACF technology?

I am uncomfortable with your proposal to gold plate 500-2000A because of
difficulty in uniformity/porosity, etc.  I'd
suggest tracking down a specialty plating house to ask their confidence on
non-pourous plated gold with 500A thickness.  I recommend calling HP
(whatever their name is now) in Santa Rosa.  If you find out they are
uncomfortable, you may have to sputter gold on...  I have my large panel
coater company that I trust, but that's later if you need them.


I had a few years of experience developing a fluxless solder chip
attachement process to FPD's. Feel free to ask the metallurgy issues.

Carey

>-----Original Message-----
>From: Scott Rebman [mailto:[log in to unmask]]
>Sent: Tuesday, November 23, 1999 8:33 AM
>To: [log in to unmask]
>Subject: [TN] Gold plating specifications
>
>
>Good day all,
>
>I am going to specify gold plating on a PCB and am curious as to how the
>rest of the world specifies such things.
>
>The board is FR-4, double sided with 2 oz copper.  The quote I currently
>have  is for electrolytic plating 0.05~0.20um thick.  The board is
>populated with both through hole and SMT components.
>
>The purpose of going with the gold plating is to keep the pads under an
>elastomeric connector from oxidizing.  Oxidation on these pads has caused
>problems with segments of an LCD becoming dim or blank.
>
>Thanks in advance for the assistance.  With the exception of a few flaming
>jerks, this is a great board.
>
>Scott
>
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