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November 1999

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Subject:
From:
Felix Lane <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Nov 1999 21:06:31 +0000
Content-Type:
text/plain
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text/plain (27 lines)
two suggestions,

     1:   cut the stencil hole with a thermal image (4 quadrants). this
allows the paste to collect on the plated               perimeter without
allowing paste through the centre.

     2:   Allow the hole to fill 100% but fit an underside support pin the
same diameter of the plated hole.
          When the board releases from the pin a paste vortex will be
formed taken the shape of a cone.

Felix

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