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November 1999

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Subject:
From:
Brunker Ed <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Nov 1999 08:52:41 -0000
Content-Type:
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When fabricating PCBs with blind vias, are there any alternatives to double
plating the outer layers? What design for manufacturability issues are there
regarding this technology?
Regards
Edward Brunker
Principal Process Engineer
Sendo
Centrelink House
Small Heath Business Park
B10 0HJ
UK

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