brian carlson wrote:
>
> Technet,
>
>    Can someone give me an insight on benefits or possible disadvantages to pulse plating. I am interested to hear some stories of what happens to the Cu thickness in the hole wall when aspects ratios increase to 15:1. Any feedback is welcome.
>
> Rgds,
> Brian

        At last 1 have a chance to add something to the forum.

        I have used it since 1995. It works swell. We plate  16:1 aspect ratios
in boards upto 240 mils. thick at current densities of 28 to 34 asf and
not only is it faster than DC you do get less plating on the surface
than with DC. We plated sample boards recently with 4 mil track and gap
to give 1.6 mils in the holes using pulse and DC. we sectioned isolated
and unshielded tracks and measured the plating thickness. With pulse we
found 1.8 mils to 2.3 mils. with DC we found 2.3 to 3.3 mils.

        The results you get will depend on the plating cell configuration, eg
annode to cathode distance, stick anodes or baskets, air or eductor
agitation, top laoding jigs or stick jigs. Whose chemistry and rectifier
system you use will also contribute the the degree of success you
achieve.

Regards

Roger Hammond

One of the majority who normal read the postings and learn.

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