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November 1999

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Subject:
From:
"Thorup, John" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Nov 1999 11:57:31 -0800
Content-Type:
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text/plain (56 lines)
This spec is intended to standardize what constitutes the acceptability of
electronic assemblies.  In this case it would control the acceptability of
the workmanship employed in bonding the component using the method and
materials specified by the Design Engineer.  This would normally be
specified on the work print or notes and not decided upon during
manufacturing.  This assumes that bonding is specified for the control of
weight, support, vibration, etc and is not applied as an assembly fixture or
convenience.  As far as your capacitor, my opinion is that bonding would not
be necessary for most end uses.
John Thorup
> -----Original Message-----
> From: Jean-Francois Bissonnette [SMTP:[log in to unmask]]
> Sent: Wednesday, November 24, 1999 11:23 AM
> To:   [log in to unmask]
> Subject:      [TN] Component installation:  adhesive mounting
>
> IPC-A-610 rev. B, section 2.4.2, gives some indication on component
> bounding.  Nothing is said about the weight of the components to be
> bounded.
> If an axial capacitor is installed flush with the board and is small
> (a little larger than a 1W resistor), and not very heavy, does it have to
> be
> bounded???
>
> Thank You!
>
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