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November 1999

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Subject:
From:
Aric Parr <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Nov 1999 13:12:15 EST
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Greetings,
        We are in the process of setting up our first high volume pin in hole reflow
process. We have a fairly large blade on the header, with a large hole on the
PCB. We seem to be forcing paste through the hole and it hangs out the bottom.

        Does anyone have any suggestions about stencil aperture dimensions and
shields so that we don't force solder paste out the bottom of the PCB and
make a mess of our tooling.

Thanks,

Aric Parr
Sr. Process Engineer
Eaton Corporation
1400 S. Livernois
PO Box 5020
Rochester Hills, MI 48308-5020
248 608 7780
[log in to unmask]

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