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November 1999

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Subject:
From:
brian carlson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Nov 1999 08:18:55 -0800
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Technet,

   Can someone give me an insight on benefits or possible disadvantages to pulse plating. I am interested to hear some stories of what happens to the Cu thickness in the hole wall when aspects ratios increase to 15:1. Any feedback is welcome.

Rgds,
Brian



Brian Carlson
Technical Support Engineer
Yamamoto Mfg. (USA), Inc.

(408)944-8368 (Office)
(800)514-6246 (Pager)
(408)944-1361 (Fax)

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