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November 1999

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Subject:
From:
Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Nov 1999 18:06:53 -0500
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Scott,

Not claiming to have intimate knowledge of LCD interfaces, but wouldn't it
be good to put a layer of nickel between the copper foil and gold plating to
act as a cheap diffusion barrier, much like is commonly used for wire
bonding (COB) applications?

Was thinking of 2.5-7.6 um of low stress nickel

Steven Creswick - CTS Microelectronics

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