Dear TechNetters,

I have a substrate with BGA pattern where BGA is fanned out for vias.
Dimensions are following:

Diameter of the ball: 30 mil
Pitch: 50 mil
via drill size: 6 mil
via with annular ring: 10 mil

The substrate is solder masked for CGA attachment but exposing all the vias
(no solder mask on vias) and of course, BGA pattern.  CGA attachment cannot
be done because one BGA pad is too close to the via fanned out from another
BGA pad (average distance between two is 5 mil) which will cause short in
the event of solder bridge between the BGA pad and the via during eutectic
solder reflow process.

Is there any way that i can fix this problem without sending these
substrates back to manufacturer for remasking?
Thanks in advance.


Jong Kadesch

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