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November 1999

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From:
김달영 차장 전자 증평공장품질보증팀 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum. <[log in to unmask]>
Date:
Fri, 19 Nov 1999 11:39:30 +0900
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 Dear Technetters ;

  Does anybody can instruct me the minimum bond strength between bonding
layers?
  I know there is a test method in IPC-TM-650, but couldn't find any
requirement value
  about it.
  Thanks for your attention.

Tal Young Kim
Manager, Quality Assurance Team
Doosan Corporation Electro-Materials BG
Tel : 82-445-820-8451
Fax : 82-445-820-8300
E-mail:[log in to unmask]

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