I need a little insight from those of you in the fab end of the
industry regarding an issue we have seen on a few incoming fabs. They are
processed by the supplier using a horizontal HASL process, and we are
finding random instances of partially or fully exposed copper on pads.
Meaning, you may have one pad out of a row of a QFP pattern or one pad out
of an entire BGA array that is bare copper even though all
adjacent/surrounding pads are fully covered with HASL. Is this something
inherent in the horizontal HASL process? If so, what is the phenomena that
causes it? If not horizontal HASL processing, what are other potential
causes? I have my ideas, but am looking for others. Enquiring minds want to
know....

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
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