Hi Louis! Take a look at ANSIJ-STD-003 specification or the ANSIJ-STD-003A
interm final draft specification. The document contains a number of test methods
that can be used.

Dave Hillman
Rockwell Collins
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Louis Hart <[log in to unmask]> on 11/02/99 09:59:45 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Louis Hart <[log in to unmask]>

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Subject:  [TN] Solderability Measurement



Technetters, good morning, you may have seen my recent post on the importance of
good measurements.  I need a measuring technique.

Our sister PC (I work in assembly) fab shop is introducing a new process.  I
want to make sure the boards it gives us, and our own processing, produce good
solder joints - surface mount, in particular.  Any ideas or experience on
quantifying solderability or a good solder joint?  Microresistance, shear or
pull strength, something to be seen in a cross-section?  Any ideas or comments
would be gratefully received.

Louis Hart, Quality Manager
Compunetix Instrumentation Systems Division
412-858-6184

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