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November 1999

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Date:
Tue, 16 Nov 1999 09:06:19 +0800
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----------
送件者: Somsak O. <[log in to unmask]>
收件者: apyeo <[log in to unmask]>
副本抄送: KS Wat <[log in to unmask]>; Wichet R.
<[log in to unmask]>; janjiang <[log in to unmask]>; Charter-HK-Tony
Fung <[log in to unmask]>
主旨: Re: Fw: PCB Fabrication,Vendor Supplier Survey & ESD Requirements
日期: 1999年11月16日 PM 10:16

DEAR AP YEO

  THANK YOU VERY MUCH FOR YOUR EMAIL AND QUICK ACTIONS. WE ARE LOOKING
FORWARD TO MAKE THE AUDIT AS PER YOUR DOCUMENTATION. THANK YOU.
With Best Regards
Somsak O.
[log in to unmask]
    -----Original Message-----
    From: apyeo <[log in to unmask]>
    To: Somsak O. <[log in to unmask]>
    Cc: KS Wat <[log in to unmask]>; Wichet R.
<[log in to unmask]>; janjiang <[log in to unmask]>; Charter-HK-Tony
Fung <[log in to unmask]>; Charter-GZ-KS Wat
<[log in to unmask]>
    Date: Monday, November 15, 1999 12:48 AM
    Subject: Re: Fw: PCB Fabrication,Vendor Supplier Survey & ESD
Requirements


    Dear Somsak,
    HASL finished products are currently produced in our Shenzhen plant.
    We can prepare the necessary information & hand over to you in
    GuangZhou plant.If you have questionaire do send us in advance.
    Regards,
    ap yeo-
    At 02:20 PM 11/15/99 -0800, Somsak O. wrote:

        DEAR AP YEO
                         GOOD AFTERNOON ! COULD YOU PLEASE KINDLY MAKE
NECESSARY PREPARATION OF YOUR COMPANY INFORMATION AS WE RECEIVED VERY
DETAIL INFORMATION REQUIRED BY OUR CUSTOMER.PLEASE ADVISE VIA RETURN
WHETHER IT IS POSSIBLE FOR YOU TO GET ALL DETAIL INFORMATION WHILS WE ARE
VISITING YOUR FACTORY. THANK YOU.
        With Best Regards
        Somsak O.
        [log in to unmask]
        -----Original Message-----
        From: John Blankevoort <[log in to unmask]>
        To: Wichet R. <[log in to unmask]>
        Cc: Morgan Taylor <[log in to unmask]>; George E Powell
<[log in to unmask]>; [log in to unmask] <[log in to unmask]>;
[log in to unmask] <[log in to unmask]>
        Date: Sunday, November 14, 1999 7:18 PM
        Subject: RE: PCB Fabrication,Vendor Supplier Survey & ESD
Requirements

        Wichet,

        Thank you for your thorough response. It is encouraging to see that
we both use the same IPC documents to reference our standards and
guidelines. I would like to add that IPC-RB-276 is further supplemented by
the IPC-6011 series.

        As you are aware our vendor survey does not cover PCB
fabrication/manufacturing issues. It is appreciated that you have supplied
a sample Process Audit Report for the PCB vendor survey/audit scheduled for
this November. I did notice on this report that there was no Form # or
Revision on the document. We are looking for the link back to your internal
documents, please advise.

        Our greater concern is the quality of the PCB manufacturer that you
will be selecting. Naturally we have been in close contact with our current
PCB suppliers and we know the product quality. In considering your upcoming
audit of your PCB supplier please be aware that in addition to an
audit/survey copy, we would like to request the following items:

        Company Name & Point of Contact
        Location of Supplier
        Company History (products, delivery, capability, capacity etc)
        List of internal Workmanship Standards
        Manufacturing Process
        Manufacturing Order/Travelers (sample is ok)
        Testing & Inspection

        And potentially for future use, PCB Coupon samples of:

        System, Sensor and Illumination PCB's, microsectioned according to
IPC-TM-650. We are looking for all IPC-A-600 Class 2 acceptability
criteria. Please ensure that adequate micro sectioning methods are used,
for if improperly done these methods can conceal anomalies rather than
revealing them.

        The ESD protocols for your assembly areas are appropriate. All
personnel are conscious of the potential ESD hazards and are wearing wrist
straps. It is further reassuring to hear that you would make provisions in
your Class 10K SMT and Reflow areas to accommodate the wrist straps for our
product as well. It would be requested that some language be added to your
current internal ESD plan(?) that describes this added measure for our
ZAPPER product. I am assuming however, that procedure # 90-00015 Handling,
Storage, Packaging, Preservation and Delivery...contains this requirement,
please advise.

        Wichet, during our visit/survey last week my colleagues and I were
very impressed with the Stars facility. Your efforts should be applauded as
we recognized throughout the facility, the process controls, documentation,
accept/reject criteria for every process station we visited.


        John Blankevoort
        Manufacturing & QA
        ZAPCODE Products Corporation
        435-881-0922

         -----Original Message-----
        From: Wichet R. [mailto:[log in to unmask]]
        Sent: Friday, November 12, 1999 4:28 AM
        To: [log in to unmask]
        Cc: [log in to unmask]; [log in to unmask]
        Subject: PCB Fabrication,Vendor Supplier Survey & ESD Requirements
            Let me introduce myself , my name is Wichet and I am in charge
of Quality & Reliability Assurance in STARS. According to your e-mail to
Mr. Somsak & Mr. Polsak regarding " PCB Fabrication , Vendor Supplier
Survey & ESD Requirements" ,I would like to provide the information which
PCB manufacturer use as standards to you as following.
            1. What standards or processes do you use for Class 2 PCB
Fabrication?
            a.. IPC-RB-276 "Qualification and Performance Specification for
rigid board".
            b.. IPC-ML-950 Rev. C "Performance and Specification of
Multilayer Printed Wiring Board"
        2. What standards or processes do you use for Class 2 HASL ( Hot
Air Solder Leveling ). QQ-S-571 for standards SN63?
            a.. IPC-S-804 Rev.A "Solderability Test Method for Printed
Wiring Board."
            b.. QQ-S-571"Standard for 60Sn/40Pb."
        3. If applicable , what standards or processes do you use for Class
2 Preconditioning of the PCB.
            a.. IPC-S-804 Rev.A "Solderability Test Method for Printed
Wiring Board".
            b.. QQ-S-571 "Standards for 60 Sn/40Pb."
        4. What standards or processes do you use for Class 2 PCB Test
Methods for Micro sectioning.IPC-TM-650 Micro sectioning?
            a.. IPC-TM-650"Test Method Manual".
            b.. IPC-RB-276
            c.. IPC-ML-950
        5.What standards or processes do you use for Class 2 PCB Test
Method for Continuity Testing?
            a.. Reference to MIL55110 Rev.E . For open circuitry is 20 Ohm
and short circuitry is 5 Mega Ohm.
        6.What standards or processes do you use for Class 2 PCB Solder
Mask aplication?
            a.. IPC-SM-840 Rev. B"Qualification and Performance of
Permanent Polymer Coating ( Solder Mask ) for Printed Board."
        7. Other standards that PCB manufactuer use as.
            a.. IPC-D-300 Rev.G"Printed Board Dimension and Tolerance".
            b.. IPC-A-600 Rev.E "Acceptability of Printed Board".
        8. As we are using the approved PCB manufacturer by Alactel ,so
that we do not have the vendor survey information for this PCB manufacturer
yet. But we do have plan to perfrom audit for this PCB manufacturer by
ourselves on dated 22-Nov-1999. We also send the sample of the audit report
for other part manufacturer which we conducted such audit for your
reference in the attached file.

        9. ESD. We reference to EIA standard : EIA-625 for ESD practice in
STARS.
        9.1 According to your concern that the skin is not contact with a
conductive path to ground and consequently may discharge through an
assembly when handle. We would like to inform that we will be implementing
wrist strap for operator throughout assembly line in order to avoid such
problem.

        Please kindly review the above issue and advise any comment you may
have.

        Thank you & Best regards

        Wichet R.

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