----------
> 送件者: apyeo <[log in to unmask]>
> 收件者: janjiang <[log in to unmask]>; Charter-HK-Tony Fung
<[log in to unmask]>; Charter-GZ-KS Wat <[log in to unmask]>
> 主旨: ZapCode PCB Fabrication,Vendor Supplier Survey & ESDRequirements
> 日期: 1999年11月15日 PM 04:47
>
Jan/KS,
Please help to prepare the required information below & hand over
to Somsak when he visit GZ on 11/22.
Regards,
ap yeo-
>
> To: "Somsak O." <[log in to unmask]>
> From: apyeo <[log in to unmask]>
> Subject: Re: Fw: PCB Fabrication,Vendor Supplier Survey & ESD
Requirements
> Cc: "KS Wat" <[log in to unmask]>,"Wichet R."
> <[log in to unmask]>, "janjiang" <[log in to unmask]>,
> "Charter-HK-Tony Fung" <[log in to unmask]>, "Charter-GZ-KS
Wat"
> <[log in to unmask]>
> Dear Somsak,
> HASL finished products are currently produced in our Shenzhen plant.
> We can prepare the necessary information & hand over to you in
> GuangZhou plant.If you have questionaire do send us in advance.
> Regards,
> ap yeo-
> At 02:20 PM 11/15/99 -0800, Somsak O. wrote:
>>
>> DEAR AP YEO
>> GOOD AFTERNOON ! COULD YOU PLEASE KINDLY MAKE NECESSARY
>> PREPARATION OF YOUR COMPANY INFORMATION AS WE RECEIVED VERY DETAIL
>> INFORMATION REQUIRED BY OUR CUSTOMER.PLEASE ADVISE VIA RETURN WHETHER IT
IS
>> POSSIBLE FOR YOU TO GET ALL DETAIL INFORMATION WHILS WE ARE VISITING
YOUR
>> FACTORY. THANK YOU.
>> With Best Regards
>> Somsak O.
>> <mailto:[log in to unmask]>[log in to unmask]
>> -----Original Message-----
>> From: John Blankevoort
>> <<mailto:[log in to unmask]>[log in to unmask]>
>> To: Wichet R. <<mailto:[log in to unmask]>[log in to unmask]>
>> Cc: Morgan Taylor
>> <<mailto:[log in to unmask]>[log in to unmask]>;
George E
>> Powell
<<mailto:[log in to unmask]>[log in to unmask]>;
>> <mailto:[log in to unmask]>[log in to unmask]
>> <<mailto:[log in to unmask]>[log in to unmask]>;
>> <mailto:[log in to unmask]>[log in to unmask]
>> <<mailto:[log in to unmask]>[log in to unmask]>
>> Date: Sunday, November 14, 1999 7:18 PM
>> Subject: RE: PCB Fabrication,Vendor Supplier Survey & ESD Requirements
>>
>> Wichet,
>>
>> Thank you for your thorough response. It is encouraging to see that we
both
>> use the same IPC documents to reference our standards and guidelines. I
>> would like to add that IPC-RB-276 is further supplemented by the
IPC-6011
>> series.
>>
>> As you are aware our vendor survey does not cover PCB
>> fabrication/manufacturing issues. It is appreciated that you have
supplied a
>> sample Process Audit Report for the PCB vendor survey/audit scheduled
for
>> this November. I did notice on this report that there was no Form # or
>> Revision on the document. We are looking for the link back to your
internal
>> documents, please advise.
>>
>> Our greater concern is the quality of the PCB manufacturer that you will
be
>> selecting. Naturally we have been in close contact with our current PCB
>> suppliers and we know the product quality. In considering your upcoming
>> audit of your PCB supplier please be aware that in addition to an
>> audit/survey copy, we would like to request the following items:
>>
>> Company Name & Point of Contact
>> Location of Supplier
>> Company History (products, delivery, capability, capacity etc)
>> List of internal Workmanship Standards
>> Manufacturing Process
>> Manufacturing Order/Travelers (sample is ok)
>> Testing & Inspection
>>
>> And potentially for future use, PCB Coupon samples of:
>>
>> System, Sensor and Illumination PCB's, microsectioned according to
>> IPC-TM-650. We are looking for all IPC-A-600 Class 2 acceptability
criteria.
>> Please ensure that adequate micro sectioning methods are used, for if
>> improperly done these methods can conceal anomalies rather than
revealing
>> them.
>>
>> The ESD protocols for your assembly areas are appropriate. All personnel
are
>> conscious of the potential ESD hazards and are wearing wrist straps. It
is
>> further reassuring to hear that you would make provisions in your Class
10K
>> SMT and Reflow areas to accommodate the wrist straps for our product as
>> well. It would be requested that some language be added to your current
>> internal ESD plan(?) that describes this added measure for our ZAPPER
>> product. I am assuming however, that procedure # 90-00015 Handling,
Storage,
>> Packaging, Preservation and Delivery...contains this requirement, please
>> advise.
>>
>> Wichet, during our visit/survey last week my colleagues and I were very
>> impressed with the Stars facility. Your efforts should be applauded as
we
>> recognized throughout the facility, the process controls, documentation,
>> accept/reject criteria for every process station we visited.
>>
>>
>> John Blankevoort
>> Manufacturing & QA
>> ZAPCODE Products Corporation
>> 435-881-0922
>>
>> -----Original Message-----
>> From: Wichet R. [mailto:[log in to unmask]]
>> Sent: Friday, November 12, 1999 4:28 AM
>> To: [log in to unmask]
>> Cc: [log in to unmask]; [log in to unmask]
>> Subject: PCB Fabrication,Vendor Supplier Survey & ESD Requirements
>> Let me introduce myself , my name is Wichet and I am in charge of
Quality &
>> Reliability Assurance in STARS. According to your e-mail to Mr. Somsak &
Mr.
>> Polsak regarding " PCB Fabrication , Vendor Supplier Survey & ESD
>> Requirements" ,I would like to provide the information which PCB
>> manufacturer use as standards to you as following.
>> 1. What standards or processes do you use for Class 2 PCB Fabrication?
>> * IPC-RB-276 "Qualification and Performance Specification for rigid
>> board".
>> * IPC-ML-950 Rev. C "Performance and Specification of Multilayer
Printed
>> Wiring Board"
>> 2. What standards or processes do you use for Class 2 HASL ( Hot Air
Solder
>> Leveling ). QQ-S-571 for standards SN63?
>> * IPC-S-804 Rev.A "Solderability Test Method for Printed Wiring
Board."
>> * QQ-S-571"Standard for 60Sn/40Pb."
>> 3. If applicable , what standards or processes do you use for Class 2
>> Preconditioning of the PCB.
>> * IPC-S-804 Rev.A "Solderability Test Method for Printed Wiring
Board".
>> * QQ-S-571 "Standards for 60 Sn/40Pb."
>> 4. What standards or processes do you use for Class 2 PCB Test Methods
for
>> Micro sectioning.IPC-TM-650 Micro sectioning?
>> * IPC-TM-650"Test Method Manual".
>> * IPC-RB-276
>> * IPC-ML-950
>> 5.What standards or processes do you use for Class 2 PCB Test Method for
>> Continuity Testing?
>> * Reference to MIL55110 Rev.E . For open circuitry is 20 Ohm and
short
>> circuitry is 5 Mega Ohm.
>> 6.What standards or processes do you use for Class 2 PCB Solder Mask
>> aplication?
>> * IPC-SM-840 Rev. B"Qualification and Performance of Permanent
Polymer
>> Coating ( Solder Mask ) for Printed Board."
>> 7. Other standards that PCB manufactuer use as.
>> * IPC-D-300 Rev.G"Printed Board Dimension and Tolerance".
>> * IPC-A-600 Rev.E "Acceptability of Printed Board".
>> 8. As we are using the approved PCB manufacturer by Alactel ,so that we
do
>> not have the vendor survey information for this PCB manufacturer yet.
But we
>> do have plan to perfrom audit for this PCB manufacturer by ourselves on
>> dated 22-Nov-1999. We also send the sample of the audit report for other
>> part manufacturer which we conducted such audit for your reference in
the
>> attached file.
>>
>> 9. ESD. We reference to EIA standard : EIA-625 for ESD practice in
STARS.
>> 9.1 According to your concern that the skin is not contact with a
conductive
>> path to ground and consequently may discharge through an assembly when
>> handle. We would like to inform that we will be implementing wrist strap
for
>> operator throughout assembly line in order to avoid such problem.
>>
>> Please kindly review the above issue and advise any comment you may
have.
>>
>> Thank you & Best regards
>>
>> Wichet R.
>
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