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November 1999

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Subject:
From:
Jeff Hempton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 15 Nov 1999 13:19:21 -0500
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We are located in the mid-west, Indiana to be exact. Our factory is very well
controlled, humidity and temp wise. No solder splash or balls seen. Just the
occasional void. Thanx Joyce for your input!

______________________________ Forward Header __________________________________
Subject: Re: [TN] ASSY: SMD solder voids
Author:  joyce <[log in to unmask]> at Internet
Date:    11/11/1999 6:23 PM


aged solder paste sometimes have void problems...usually, under high RH% MFG
condition...If you are "lucky", you would see solder splash coupled with
voids (solder balls, etc), otherwise, it is not so easy to spot the problem
...(it was a hard lesson to learn many years ago).
where are you located? warm and high RH?
                                      jk

At 10:45 AM 11/11/99 -0500, you wrote:
>     Hi gang,
>       We are cross-sectiong some solder joints, and are seeing some
>     voiding inside the joint itself, that appears to be "air pockets" that
>     were inside the joint when reflowed. There is no visible indication
>     externally of any voiding, but it is fairly prevalent inside various
>     component solder joints when cross-sectioned.
>
>       I cannot find criteria or mention of this in the specifications I
>     have. ANSI/IPC-A-610A shows voiding criteria for thru-hole components,
>     but none for SMD.
>
>     Does anyone have knowledge they can share on this topic? Is there a
>     spec on internal SMD joint voiding available? Do you guys and gals see
>     this occasionally in your joints?
>
>     Please, enlighten me with your collective wisdoms!
>     TIA!
>
>     Jeff Hempton
>     United Technologies Electronic Controls
>
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