Louis,
What is the new process they are introducing?
Rick Howieson

>-----Original Message-----
>From:  Louis Hart [SMTP:[log in to unmask]]
>Sent:  Tuesday, November 02, 1999 9:00 AM
>To:    [log in to unmask]
>Subject:       [TN] Solderability Measurement
>
>Technetters, good morning, you may have seen my recent post on the importance
>of good measurements.  I need a measuring technique.
>
>Our sister PC (I work in assembly) fab shop is introducing a new process.  I
>want to make sure the boards it gives us, and our own processing, produce
>good solder joints - surface mount, in particular.  Any ideas or experience
>on quantifying solderability or a good solder joint?  Microresistance, shear
>or pull strength, something to be seen in a cross-section?  Any ideas or
>comments would be gratefully received.
>
>Louis Hart, Quality Manager
>Compunetix Instrumentation Systems Division
>412-858-6184
>
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