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November 1999

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Subject:
From:
Jon Moore <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 12 Nov 1999 11:44:59 EST
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Jeff,
    We did some studies on this when I was at McDonnell-Douglas several years
ago.  We never did identify the root cause for voids in SMT joints, because
we focused primarily on reliability.  As I remember, we found no reliability
degradation with voids that were up to approximately 25% of the solder joint
volume.  I could dig through  lot of boxes and maybe retrieve some old
reports on the matter.

Jon Moore

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